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MCP6S21/2/6/8
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
B
n
1
c
φ
A
α
β
Units
L
INCHES
A1
MILLIMETERS*
A2
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
Overall Height
n
p
A
14
.026
.043
14
0.65
1.10
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A2
A1
E
E1
D
L
φ
c
B1
α
β
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
0.85
0.05
6.25
4.30
4.90
0.50
0
0.09
0.19
0
0
0.90
0.10
6.38
4.40
5.00
0.60
4
0.15
0.25
5
5
0.95
0.15
6.50
4.50
5.10
0.70
8
0.20
0.30
10
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS21117A-page 36
? 2003 Microchip Technology Inc.
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